5961-01-247-3477, SEMICONDUCTOR DEVICES,UNITIZED

1560-01-247-3486 SUPPORT,STRUCTURALCOMPONENT,AIR

National Stock Number:
5961-01-247-3477

Federal Supply Class:
5961

National Item Identification Number:
012473477

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Manufacturer Information:

985221-001	16224	TITAN CORP THE
985221-001	63702	L-3 SERVICES, INC. DBA COMMAND & CONTROL SYSTEMS SOFTWARE & EXPEDITIONARY OPERATION
FSA3167M	13715	FAIRCHILD SEMICONDUCTOR CORP COMPONENTS GROUP SUB OF SCHLUMBERGER LTD

Techincal Specification:

COMPONENT NAME AND QUANTITY	16 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC	350.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET ALL SEMICONDUCTOR DEVICE DIODE
FEATURES PROVIDED	BURN IN AND HERMETICALLY SEALED CASE
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION	TO-116
INCLOSURE MATERIAL	METAL
POWER RATING PER CHARACTERISTIC	650.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE
PROPRIETARY CHARACTERISTICS	PACS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	150.0 DEG CELSIUS JUNCTION
MOUNTING METHOD	TERMINAL
OVERALL HEIGHT	0.180 INCHES NOMINAL
OVERALL LENGTH	0.785 INCHES MAXIMUM
OVERALL WIDTH	0.325 INCHES MAXIMUM
SPECIAL FEATURES	ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
SEMICONDUCTOR MATERIAL	SILICON ALL SEMICONDUCTOR DEVICE DIODE
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	50.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE
TERMINAL LENGTH	0.100 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY	14 PRINTED CIRCUIT

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